W66DP2RQQAHJ

Product Overview

IC Picture

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Manufacturer Part No W66DP2RQQAHJ
Brand WINBOND
Item LPDDR4X SDRAM
Part No 256MX32 LPDDR4

Product Details

Package TFBGA-200
Outpack
RoHS RoHS
Voltage 0.6 V
Temperature -40 C~+105 C
Speed 4266 MBPS
Std. Pack Qty
Std. Carton

Available Offers

Description Qty Datecode
W66DP2RQQAHJ 23,040 25+ Get Quote
W66DP2RQQAHJ 20,000 25 Get Quote
W66DP2RQQAHJ 10,368 Get Quote
W66DP2RQQAHJ 4,608 25 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4U8E3S4AD-GFCL FBGA-200 0.6 V 4266 MBPS -40 C~+105 C
K4U8E3S4AD-GFCL03V FBGA-200 0.6 V 4266 MBPS -40 C~+105 C
K4U8E3S4AD-GHCL FBGA-200 0.6 V 4266 MBPS -40 C~+105 C
K4U8E3S4AD-GHCL02V FBGA-200 0.6 V 4266 MBPS -40 C~+105 C
K4U8E3S4AD-GHCLT2V FBGA-200 0.6 V 4266 MBPS -40 C~+105 C
K4U8E3S4AD-GUCL FBGA-200 0.6 V 4266 MBPS -40 C~+105 C
W66DP2RQTAHJ TFBGA-200 0.6 V 4266 MBPS -40 C~+105 C