脚位/封装 | TSOP2 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | normal power & commercial temp |
速度 | 133MHz 3-3-3 |
标准包装数量 | |
标准外箱 | |
Number Of Words | 32M |
Bit Organization | x8 |
Density | 256M |
Package Material | lead & halogen free |
Hynix Memory | H |
No Of Banks | 4 banks |
Die Generation | 8th |
Product Family | DRAM |
Product Mode | SDR |
Shipping Method | tray |