脚位/封装 | TSOP2 |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
Die Generation | 5th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V281620HCTP-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HCTP-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HCTP-K | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HET-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HGLT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HGT-6/7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HGT-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HGTP-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620HT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |