脚位/封装 | TSOP2 |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 4M |
Bit Organization | x32 |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V283220CTP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V283220DTP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V283220ETP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V283220LT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V28322OT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V28322QT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V28322T-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9812G2DH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9812G2GH6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |