脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
HY57V643220DT-6 | 251 | 0551+ | 索取报价 |
HY57V643220DT-6 | 592 | 545 | 索取报价 |
HY57V643220DT-6 | 2,500 | 索取报价 | |
HY57V643220DT-6 | 1,920 | 06+ | 索取报价 |
HY57V643220DT-6 | 1,900 | 04+ | 索取报价 |
HY57V643220DT-6 | 11,520 | 索取报价 | |
HY57V643220DT-6 | 24,000 | 05+06+ | 索取报价 |
HY57V643220DT-6 | 500 | 索取报价 | |
HY57V643220DT-6 | 800 | 索取报价 | |
HY57V643220DT-6 | 24,000 | 05+ | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
EM638325-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325BG-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325BG-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325T3-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6 #160 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6C | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6T | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6TC | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |