HY57V643220DT-6
Product Details
| Package | TSOP2(86) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 2M |
| Bit Organization | x32 |
| Density | 64M |
| Package Material | normal |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 4 banks |
| Die Generation | 5th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V643220DT-6 | 251 | 0551+ | Get Quote |
| HY57V643220DT-6 | 592 | 545 | Get Quote |
| HY57V643220DT-6 | 2,500 | Get Quote | |
| HY57V643220DT-6 | 1,920 | 06+ | Get Quote |
| HY57V643220DT-6 | 1,900 | 04+ | Get Quote |
| HY57V643220DT-6 | 11,520 | Get Quote | |
| HY57V643220DT-6 | 24,000 | 05+06+ | Get Quote |
| HY57V643220DT-6 | 500 | Get Quote | |
| HY57V643220DT-6 | 800 | Get Quote | |
| HY57V643220DT-6 | 24,000 | 05+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EM638325-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325BG-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325BG-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325T3-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS-6 #160 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS-6C | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS-6T | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS-6TC | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |