脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | -40 C~+85 C |
速度 | 200 MHZ |
标准包装数量 | |
标准外箱 | |
Bit Organization | x32 |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | low power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V643220CLT-5I | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |
HY57V643220CT-5I | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |
IS42S32200L-5TI | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |
K4S643232E-TI50000 | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |
K4S643232ETI-60/50 | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |
K4S643232HTI50 | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |
K4S643232HUI50 | TSOP2(86) | 3.3 V | 200 MHZ | -40 C~+85 C |