HY5V26CLF-HBGA
产品详情
| 脚位/封装 | FBGA |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | |
| 速度 | 133MHz, CL3 3-3-3 |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 4th Gen. |
| Power Consumption | low power |
| Shipping Method | tray |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| HY5V26CLF-HBGA | 10,002 | 2003+ | 索取报价 |