| Package | FBGA |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | |
| Speed | 133MHz, CL3 3-3-3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 4th Gen. |
| Power Consumption | low power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY5V26CLF-HBGA | 10,002 | 2003+ | Get Quote |