图片仅供参考
| 制造商IC编号 | K4B1G0846D-ACF8 |
| 厂牌 | SAMSUNG/三星 |
| IC 类别 | DDR3 SDRAM |
| IC代码 | 128MX8 DDR3 |
| 脚位/封装 | FBGA-78 |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.35V |
| 温度规格 | 0 C~+85 C |
| 速度 | 1066 MBPS |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Internal Banks | 8 Banks |
| Power | Normal Power |
| Generation | 5th Generation |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| K4B1G0846C-CF8 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846C-ZCF8 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846D-HCF0 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846D-HCF00HB | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846D-HCF8 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846D-HCF8000 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846E-HCF8 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846E-HCF8000 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846F-HCF8 | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |
| K4B1G0846F-HCF80DE | FBGA-78 | 1.35V | 1066 MBPS | 0 C~+85 C |