图片仅供参考
制造商IC编号 | K4B1G0846F-HCH9 |
厂牌 | SAMSUNG/三星 |
IC 类别 | DDR3 SDRAM |
IC代码 | 128MX8 DDR3 |
共通IC编号 | K4B1G0846F-HCH9000 |
K4B1G0846F-HCH9T |
脚位/封装 | FBGA-78 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 1.35V |
温度规格 | 0 C~+85 C |
速度 | 1333 MBPS |
标准包装数量 | |
标准外箱 | |
Number Of Words | 128M |
Bit Organization | x8 |
Density | 1G |
Internal Banks | 8 Banks |
Generation | 7th Generation |
Power | Normal Power |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
K4B1G0846F-HCH9 | 20,480 | 索取报价 | |
K4B1G0846F-HCH9 | 20,480 | 11+ | 索取报价 |
K4B1G0846F-HCH9 | 20,000 | 11+ | 索取报价 |
K4B1G0846F-HCH9 | 10,240 | 索取报价 | |
K4B1G0846F-HCH9 | 30,000 | 2011+ | 索取报价 |
K4B1G0846F-HCH9 | 10 | 索取报价 | |
K4B1G0846F-HCH9 | 50,000 | 2011+ | 索取报价 |
K4B1G0846F-HCH9 | 3,000 | 10+ | 索取报价 |
K4B1G0846F-HCH9 | 60,000 | 2011+ | 索取报价 |
K4B1G0846F-HCH9 | 30,000 | 2011 | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
K4B1G0846C-ZCG8 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846C-ZCG9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846C-ZCH9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846CZCG7 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846D-HCF9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846D-HCH9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846D-HCH9000 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846E-HC9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846E-HCH8T | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
K4B1G0846E-HCH9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |