图片仅供参考
制造商IC编号 | K4H280838D-TLB3 |
厂牌 | SAMSUNG/三星 |
IC 类别 | DDR1 SDRAM |
IC代码 | 16MX8 DDR1 |
脚位/封装 | TSOP2 |
外包装 | |
无铅/环保 | 含铅 |
电压(伏) | 2.5 V |
温度规格 | 0 C~+85 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16M |
Bit Organization | x8 |
Density | 128M |
Internal Banks | 4 Banks |
Generation | 5th Generation |
Power | Low Power |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
K4H280838BTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838C-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838C/D-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838CTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838D-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838D-TCB3000 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838DTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838E-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838E-TCB3 S | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838E-TCB3 SAMS | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |