K4M56163PI-BG75 NBSP
产品概述
图片仅供参考
| 制造商IC编号 | K4M56163PI-BG75 NBSP |
| 厂牌 | SAMSUNG/三星 |
| IC 类别 | SDRAM MOBILE |
| IC代码 | 16MX16 SD |
产品详情
| 脚位/封装 | FBGA |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.8 V |
| 温度规格 | -25 C~+85 C |
| 速度 | 133 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 10th Generation |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| K4M56163PI-BG75 NBSP | 556 | 索取报价 |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| K4M56163PC-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PE-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PF-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BE75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG750 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG7500 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75000 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75000SAMSUNG | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG750JR | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |