K4M56163PI-BG75 NBSP
Product Overview
Images are for reference only
| Manufacturer Part No | K4M56163PI-BG75 NBSP |
| Brand | SAMSUNG |
| Item | SDRAM MOBILE |
| Part No | 16MX16 SD |
Product Details
| Package | FBGA |
| Outpack | |
| RoHS | RoHS |
| Voltage | 1.8 V |
| Temperature | -25 C~+85 C |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Generation | 10th Generation |
| Power | Low, i-TCSR & PASR & DS |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| K4M56163PI-BG75 NBSP | 556 | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| K4M56163PC-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PE-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PF-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BE75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG750 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG7500 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75000 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75000SAMSUNG | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG750JR | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |