图片仅供参考
制造商IC编号 | K4M56163PN-DG60 |
厂牌 | SAMSUNG/三星 |
IC 类别 | SDRAM MOBILE |
IC代码 | 16MX16 SD |
脚位/封装 | FBGA |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 1.8 V |
温度规格 | -25 C~+85 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Internal Banks | 4 Banks |
Generation | 14th Generation |
Power | Low, i-TCSR & PASR & DS |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
K4M56163PF-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PG-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PI-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60 PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG6000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG600JR | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG600JR PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |