| 脚位/封装 | BGA-24 |
| 外包装 | TAPE ON REEL |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.0V |
| 温度规格 | -40 C~+85 C |
| 速度 | 104MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Density | 56M |
| Product Series | Dual Die Flash Package |
| Package Material | Low Halogen Lead (Pb)-Free |
| Process Technology | 90nm, MirrorBit Technology |
| Flash Interface | Serial (SPI) |
| Simultaneous Read Write | No |
| Model Number | 20 |
| Package Type | 13" Tape & Reel |
| Data Rate | SDR, <100 MHz |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| S70FL256P0XBFI200 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |
| S70FL256P0XBHI210 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |