脚位/封装 | BGA-24 |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.0V |
温度规格 | -40 C~+85 C |
速度 | 104MHZ |
标准包装数量 | |
标准外箱 | |
Density | 56M |
Product Series | Dual Die Flash Package |
Package Material | Low Halogen Lead (Pb)-Free |
Process Technology | 90nm, MirrorBit Technology |
Data Rate | SDR, <100 MHz |
Flash Interface | Serial (SPI) |
Simultaneous Read Write | No |
Model Number | 21 |
Package Type | Tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
S70FL256P0XBFI200 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |
S70FL256P0XBHI200 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |
S70FL256P0XBHI203 | BGA-24 | 3.0V | 104MHZ | -40 C~+85 C |