图片仅供参考
制造商IC编号 | W25Q128FVCIG |
厂牌 | WINBOND/華邦 |
IC 类别 | FLASH-QSPI-NOR |
IC代码 | 128MB SPI |
共通IC编号 | W25Q128FVCIG,0,1E |
脚位/封装 | TFBGA-24 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 2.7V~3.6V |
温度规格 | -40 C~+85 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Density | 128M |
Product Family | SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O |
Product Number Density | 128 Mbit |
Special Options | green package (Lead-free, RoHS compliant, Halogen-free(TBBA), Antimony-Oxide-free S2bO3) |
Company Prefix | winbond |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
MX25L12845GXDI-08G | TFBGA-24 | 3.3 V | 133 MHZ | -40 C~+85 C |
S25FL128LAGBHI020 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128LAGBHI023 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128LAGBHI030 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI20 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI200 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI203 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI210 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI30 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI300 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |