| 脚位/封装 | TSOP |
| 外包装 | |
| 无铅/环保 | 含铅 |
| 电压(伏) | 2.7V~3.3V |
| 温度规格 | -40 C~+85 C |
| 速度 | industrial 90ns |
| 标准包装数量 | |
| 标准外箱 | |
| Density | 128M |
| Product Family | 3V (VCC= 2.7~3.6V) |
| Company Prefix | winbond |
| Product Version | 90nm |
| Sector Type | EVIO= 1.65V to VCC(2.7~3.6V), uniform sector, lowest address sector protected |
| Packages | LFBGA-64, green (RoHS compliant) |