脚位/封装 | TSOP |
外包裝 | |
無鉛/環保 | 含鉛 |
電壓(伏) | 2.7V~3.3V |
溫度規格 | -40 C~+85 C |
速度 | industrial 90ns |
標準包裝數量 | |
標準外箱 | |
Density | 128M |
Product Family | 3V (VCC= 2.7~3.6V) |
Company Prefix | winbond |
Packages | LFBGA-64, green (RoHS compliant) |
Product Version | 90nm |
Sector Type | EVIO= 1.65V to VCC(2.7~3.6V), uniform sector, lowest address sector protected |