图片仅供参考
制造商IC编号 | W29N04GZBIBA |
厂牌 | WINBOND/華邦 |
IC 类别 | FLASH-NAND |
IC代码 | 512MX8 NAND SLC |
脚位/封装 | VFBGA-63 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 1.70-1.95V |
温度规格 | -40 C~+85 C |
速度 | 25 NS |
标准包装数量 | 210 |
标准外箱 | |
Bit Organization | x8 |
Option Information | OTP command supported(contact winbond for option information) |
Product Family | ONFI compatible NAND flash memory |
Reserved | general product |
Company Prefix | winbond |
Product Version | G |
Supply Voltage Bus Width | 1.7~1.95V and X8 device |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
MT29F4G08ABBEAH4-IT:E TR | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBEAH4-ITES:E | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBEAH4ITE | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBEAH5-IT:E | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBFAH4-IT:F | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBFAH4-IT:F TR | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MX30UF4G18AB-XKI | FBGA-63 | 1.8 V | 25NS | -40 C~+85 C |
MX30UF4G18AC-XKI | FBGA-63 | 1.8 V | 25NS | -40 C~+85 C |
TC58BYG2S0HBAI4 | BGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
TC58BYG2S0HBAI4 TRAY | BGA-63 | 1.8 V | 25 NS | -40 C~+85 C |