圖片僅供參考
製造商IC編號 | W29N04GZBIBA |
廠牌 | WINBOND/華邦 |
IC 類別 | FLASH-NAND |
IC代碼 | 512MX8 NAND SLC |
脚位/封装 | VFBGA-63 |
外包裝 | TRAY |
無鉛/環保 | 無鉛/環保 |
電壓(伏) | 1.70-1.95V |
溫度規格 | -40 C~+85 C |
速度 | 25 NS |
標準包裝數量 | 210 |
標準外箱 | |
Bit Organization | x8 |
Option Information | OTP command supported(contact winbond for option information) |
Product Family | ONFI compatible NAND flash memory |
Reserved | general product |
Company Prefix | winbond |
Product Version | G |
Supply Voltage Bus Width | 1.7~1.95V and X8 device |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
MT29F4G08ABBEAH4-IT:E TR | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBEAH4-ITES:E | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBEAH4ITE | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBEAH5-IT:E | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBFAH4-IT:F | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MT29F4G08ABBFAH4-IT:F TR | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
MX30UF4G18AB-XKI | FBGA-63 | 1.8 V | 25NS | -40 C~+85 C |
MX30UF4G18AC-XKI | FBGA-63 | 1.8 V | 25NS | -40 C~+85 C |
TC58BYG2S0HBAI4 | BGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
TC58BYG2S0HBAI4 TRAY | BGA-63 | 1.8 V | 25 NS | -40 C~+85 C |