脚位/封装 | TSOP2(86) |
外包裝 | TRAY |
無鉛/環保 | 含鉛 |
電壓(伏) | 3.3 V |
溫度規格 | 0 C~+70 C |
速度 | 166 MHZ |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Power Consumption | low power |
Shipping Method | tray |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
HY57V643220DCT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DF6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DIP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DLT6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DLTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DST-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DSTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DT-6 / DTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DT-6 2MX32SDRA | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |