K4H280838DTCB3
產品概述
圖片僅供參考
| 製造商IC編號 | K4H280838DTCB3 |
| 廠牌 | SAMSUNG/三星 |
| IC 類別 | DDR1 SDRAM |
| IC代碼 | 16MX8 DDR1 |
| 共通IC編號 | K4H280838D-TCB300 |
| K4H280838D-TCB3000 |
產品詳情
| 脚位/封装 | TSOP2 |
| 外包裝 | |
| 無鉛/環保 | 含鉛 |
| 電壓(伏) | 2.5 V |
| 溫度規格 | 0 C~+85 C |
| 速度 | 166 MHZ |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 16M |
| Bit Organization | x8 |
| Density | 128M |
| Internal Banks | 4 Banks |
| Power | Normal Power |
| Generation | 5th Generation |
供應鏈有貨
| IC 編號 | 數量 | 生產年份 | |
|---|---|---|---|
| K4H280838D-TCB3000 | 10,000 | 2009+ | 索取報價 |
| K4H280838D-TCB3000 | 10,000 | 索取報價 | |
| K4H280838D-TCB3000 | 12,000 | 索取報價 | |
| K4H280838D-TCB3000 | 6,000 | 索取報價 | |
| K4H280838DTCB3 | 6,988 | 2003+ | 索取報價 |
| K4H280838DTCB3 | 7,800 | 2003+ | 索取報價 |
| K4H280838DTCB3 | 3,980 | 03+ | 索取報價 |
| K4H280838DTCB3 | 20,000 | 2003+ | 索取報價 |
| K4H280838DTCB3 | 20,000 | 索取報價 | |
| K4H280838DTCB3 | 3,360 | 索取報價 |
FFFE/互通料號 (形式，腳位和功能對等)
| IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
|---|---|---|---|---|
| K4H280838BTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838C-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838C/D-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838CTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838D-TLB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3 S | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3 SAMS | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3000 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TLB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |