圖片僅供參考
製造商IC編號 | K4H280838BTCB3 |
廠牌 | SAMSUNG/三星 |
IC 類別 | DDR1 SDRAM |
IC代碼 | 16MX8 DDR1 |
脚位/封装 | TSOP2 |
外包裝 | |
無鉛/環保 | 含鉛 |
電壓(伏) | 2.5 V |
溫度規格 | 0 C~+85 C |
速度 | 166 MHZ |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 16M |
Bit Organization | x8 |
Density | 128M |
Internal Banks | 4 Banks |
Generation | 3rd Generation |
Power | Normal Power |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
K4H280838C-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838C/D-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838CTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838D-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838D-TCB3000 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838D-TLB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838DTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838E-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838E-TCB3 S | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H280838E-TCB3 SAMS | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |