K4H280838BTCB3
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4H280838BTCB3 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR1 SDRAM |
| IC-Code | 16MX8 DDR1 |
Produktbeschreibung
| Gehäuse | TSOP2 |
| Verpackung | |
| RoHS | Leaded |
| Spannungsversorgung | 2.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 166 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 16M |
| Bit Organization | x8 |
| Density | 128M |
| Internal Banks | 4 Banks |
| Generation | 3rd Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4H280838BTCB3 | 4.800 | Anfrage senden | |
| K4H280838BTCB3 | 4.800 | 01 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4H280838C-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838C/D-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838CTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838D-TCB300 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838D-TCB3000 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838D-TLB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838DTCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3 | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3 S | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H280838E-TCB3 SAMS | TSOP2 | 2.5 V | 166 MHZ | 0 C~+85 C |