K4H510838G-HCB3
產品概述
圖片僅供參考
| 製造商IC編號 | K4H510838G-HCB3 |
| 廠牌 | SAMSUNG/三星 |
| IC 類別 | DDR1 SDRAM |
| IC代碼 | 64MX8 DDR1 |
| 共通IC編號 | K4H510838G-HCB3T00 |
| K4H510838G-HCB3TCV |
產品詳情
| 脚位/封装 | FBGA-60 |
| 外包裝 | |
| 無鉛/環保 | 無鉛/環保 |
| 電壓(伏) | 2.5 V |
| 溫度規格 | 0 C~+85 C |
| 速度 | 166 MHZ |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 64M |
| Bit Organization | x8 |
| Density | 512M |
| Internal Banks | 4 Banks |
| Generation | 8th Generation |
| Power | Normal Power |
供應鏈有貨
| IC 編號 | 數量 | 生產年份 | |
|---|---|---|---|
| K4H510838G-HCB3 | 4,000 | 索取報價 | |
| K4H510838G-HCB3 | 20 | 1031 | 索取報價 |
| K4H510838G-HCB3 | 2,000 | 索取報價 | |
| K4H510838G-HCB3 | 2,000 | 2010+ | 索取報價 |
| K4H510838G-HCB3 | 20,000 | 索取報價 | |
| K4H510838G-HCB3 | 2,000 | 索取報價 | |
| K4H510838G-HCB3 | 10,000 | 索取報價 | |
| K4H510838G-HCB3 | 60,000 | 09+ | 索取報價 |
| K4H510838G-HCB3 | 1,120 | 2010+ | 索取報價 |
| K4H510838G-HCB3TCV | 30,000 | 索取報價 |
FFFE/互通料號 (形式，腳位和功能對等)
| IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
|---|---|---|---|---|
| K4H510838B-VCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838B-VLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838B-ZCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838B-ZLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838BGCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838C-ZCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838C-ZCB30 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838C-ZCB3000 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838C-ZCB3T | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838C-ZLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |