圖片僅供參考
製造商IC編號 | K4M56163PN-BG600JR PER |
廠牌 | SAMSUNG/三星 |
IC 類別 | SDRAM MOBILE |
IC代碼 | 16MX16 SD |
脚位/封装 | FBGA |
外包裝 | |
無鉛/環保 | 無鉛/環保 |
電壓(伏) | 1.8 V |
溫度規格 | -25 C~+85 C |
速度 | 166 MHZ |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Internal Banks | 4 Banks |
Generation | 14th Generation |
Power | Low, i-TCSR & PASR & DS |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
K4M56163PF-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PG-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PI-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60 PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG6000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG600JR | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-DG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |