K4M56163PI-BG60
產品概述
圖片僅供參考
| 製造商IC編號 | K4M56163PI-BG60 |
| 廠牌 | SAMSUNG/三星 |
| IC 類別 | SDRAM MOBILE |
| IC代碼 | 16MX16 SD |
產品詳情
| 脚位/封装 | FBGA |
| 外包裝 | TRAY |
| 無鉛/環保 | 無鉛/環保 |
| 電壓(伏) | 1.8 V |
| 溫度規格 | -25 C~+85 C |
| 速度 | 166 MHZ |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 10th Generation |
FFFE/互通料號 (形式，腳位和功能對等)
| IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
|---|---|---|---|---|
| K4M56163PF-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PG-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG60 PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG6000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG60000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG600JR | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG600JR PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-DG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |