K4M56163PI-BG60
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4M56163PI-BG60 |
| Hersteller | SAMSUNG |
| Produktkategorie | SDRAM MOBILE |
| IC-Code | 16MX16 SD |
Produktbeschreibung
| Gehäuse | FBGA |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 1.8 V |
| Betriebstemperatur | -25 C~+85 C |
| Geschwindigkeit | 166 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 10th Generation |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4M56163PF-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PG-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG60 PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG6000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG60000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG600JR | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-BG600JR PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
| K4M56163PN-DG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |