Bilder dienen nur der Illustration
Hersteller-Nummer | K4M56163PN-BG60 PER |
Hersteller | SAMSUNG |
Produktkategorie | SDRAM MOBILE |
IC-Code | 16MX16 SD |
Gehäuse | FBGA |
Verpackung | |
RoHS | RoHS |
Spannungsversorgung | 1.8 V |
Betriebstemperatur | -25 C~+85 C |
Geschwindigkeit | 166 MHZ |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Internal Banks | 4 Banks |
Generation | 14th Generation |
Power | Low, i-TCSR & PASR & DS |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
K4M56163PF-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PG-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PI-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG6000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG60000 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG600JR | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-BG600JR PER | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |
K4M56163PN-DG60 | FBGA | 1.8 V | 166 MHZ | -25 C~+85 C |