K4B2G0846B-HYH9
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G0846B-HYH9 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 256MX8 DDR3 |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1333 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 3rd Generation |
| Power | Low VDD(1.35V) |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G0846B-HYH9 | 4.000 | Anfrage senden | |
| K4B2G0846B-HYH9 | 742 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4B2G0846C-HYH9 IC | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C-HYH9000 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C/D-B/HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C/D-HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C/D-HCH9000 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-BCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH90 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH900 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH9000 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |