K9K1G08UOBJIBO
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K9K1G08UOBJIBO |
| Hersteller | SAMSUNG |
| Produktkategorie | FLASH-NAND |
| IC-Code | 128MX8 NAND SLC |
Produktbeschreibung
| Gehäuse | FBGA-63 |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 2.7V-3.6V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 25 NS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Pre Prog Version | Serial |
| Generation | 3rd Generation |
| Classification | SLC DDP |
| Cust Bad Block | Include Bad Block |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K9K1G08UOBJIBO | 4.000 | Anfrage senden | |
| K9K1G08UOBJIBO | 12.500 | Anfrage senden | |
| K9K1G08UOBJIBO | 519 | Anfrage senden | |
| K9K1G08UOBJIBO | 6.492 | 07+ | Anfrage senden |
| K9K1G08UOBJIBO | 1.263 | 200546+ | Anfrage senden |
| K9K1G08UOBJIBO | 2.800 | 2006+ | Anfrage senden |
| K9K1G08UOBJIBO | 1.215 | 200546+ | Anfrage senden |
| K9K1G08UOBJIBO | 4.009 | 2007+ | Anfrage senden |
| K9K1G08UOBJIBO | 3.547 | 2007+ | Anfrage senden |
| K9K1G08UOBJIBO | 1.854 | 2007+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| EN27LN1G08-25CEIP | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| F59L1G81MA -25BIG2Y | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BIR | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2CFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI-TR | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G084-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G084-BLI-TR | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML08G168-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |