K9K1G08UOBJIBO
Product Overview
Images are for reference only
| Manufacturer Part No | K9K1G08UOBJIBO |
| Brand | SAMSUNG |
| Item | FLASH-NAND |
| Part No | 128MX8 NAND SLC |
Product Details
| Package | FBGA-63 |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 2.7V-3.6V |
| Temperature | -40 C~+85 C |
| Speed | 25 NS |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Generation | 3rd Generation |
| Pre Prog Version | Serial |
| Classification | SLC DDP |
| Cust Bad Block | Include Bad Block |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| K9K1G08UOBJIBO | 4,000 | Get Quote | |
| K9K1G08UOBJIBO | 12,500 | Get Quote | |
| K9K1G08UOBJIBO | 519 | Get Quote | |
| K9K1G08UOBJIBO | 6,492 | 07+ | Get Quote |
| K9K1G08UOBJIBO | 1,263 | 200546+ | Get Quote |
| K9K1G08UOBJIBO | 2,800 | 2006+ | Get Quote |
| K9K1G08UOBJIBO | 1,215 | 200546+ | Get Quote |
| K9K1G08UOBJIBO | 4,009 | 2007+ | Get Quote |
| K9K1G08UOBJIBO | 3,547 | 2007+ | Get Quote |
| K9K1G08UOBJIBO | 1,854 | 2007+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EN27LN1G08-25CEIP | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| F59L1G81MA -25BIG2Y | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BIR | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2CFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI-TR | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G084-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML08G168-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34MLI01G084-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |