W971GG8JB-3
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | W971GG8JB-3 |
| Hersteller | WINBOND |
| Produktkategorie | DDR2 SDRAM |
| IC-Code | 128MX8 DDR2 |
Produktbeschreibung
| Gehäuse | TFBGA-60 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.8 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 667 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4T1G084QD-ZLE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QD/E-HCE60MJ/00 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QD/E/Q-HCE60MJ/00 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QD0-ZCE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QE-BCE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QE-HCE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QE-HCE6/HCF7 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QE-HCE60 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QE-HCE600 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G084QE-HCE6000 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |