Images are for reference only
Manufacturer Part No | W971GG8JB-3 |
Brand | WINBOND |
Item | DDR2 SDRAM |
Part No | 128MX8 DDR2 |
Package | TFBGA-60 |
Outpack | |
RoHS | RoHS |
Voltage | 1.8 V |
Temperature | 0 C~+85 C |
Speed | 667 MBPS |
Std. Pack Qty | |
Std. Carton |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
K4T1G084QD-ZLE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QD/E-HCE60MJ/00 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QD/E/Q-HCE60MJ/00 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QD0-ZCE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QE-BCE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QE-HCE6 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QE-HCE6/HCF7 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QE-HCE60 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QE-HCE600 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |
K4T1G084QE-HCE6000 | FBGA-60 | 1.8 V | 667 MBPS | 0 C~+85 C |