Package | TSOP2 |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | normal power & commercial temp |
Speed | 133MHz 3-3-3 |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 32M |
Bit Organization | x8 |
Density | 256M |
Package Material | lead & halogen free |
Hynix Memory | H |
No Of Banks | 4 banks |
Die Generation | 8th |
Product Family | DRAM |
Product Mode | SDR |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
H57V2582GTR-75C | 10,000 | Get Quote | |
H57V2582GTR-75C | 40,000 | Get Quote | |
H57V2582GTR-75C | 13 | Get Quote | |
H57V2582GTR-75C | 40,000 | 12+ | Get Quote |
H57V2582GTR-75C | 40,000 | 13 | Get Quote |
H57V2582GTR-75C | 40,000 | Get Quote | |
H57V2582GTR-75C | 3,028 | 11+ | Get Quote |
H57V2582GTR-75C | 11,520 | 2010 | Get Quote |
H57V2582GTR-75C | 11,520 | 2010+ | Get Quote |
H57V2582GTR-75C | 20,000 | 11+ | Get Quote |