H5TQ4G83CFR-TEI

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No H5TQ4G83CFR-TEI
Brand SK HYNIX
Item DDR3L SDRAM
Part No 512MX8 DDR3

Product Details

Package FBGA-78
Outpack TRAY
RoHS RoHS
Voltage 1.5 V
Temperature -40 C~+95 C
Speed 2133 MBPS
Std. Pack Qty
Std. Carton
Number Of Words 512M
Bit Organization x8
Density 4G
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 4th
No Of Banks 8 banks
Product Family DRAM
Shipping Method tray

Available Offers

Description Qty Datecode
H5TQ4G83CFR-TEI 3,000 Get Quote
H5TQ4G83CFR-TEI 4,707 Get Quote
H5TQ4G83CFR-TEI 20,160 Get Quote
H5TQ4G83CFR-TEI 151 Get Quote
H5TQ4G83CFR-TEI 1,600 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H5TQ4G83EFR-TEI FBGA-78 1.5 V 2133 MBPS -40 C~+95 C
IS43TR85120A-093NBA1 BGA-78 1.5 V 2133 MBPS -40 C~+95 C
IS43TR85120A-093NBLI-TR BGA-78 1.5 V 2133 MBPS -40 C~+95 C
NT5CB512M8DN-FL TR TFBGA-78 1.5 V 2133 MBPS -40 C~+95 C