HY57V161610BCT-6
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | normal |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 2 banks |
| Die Generation | 3rd Gen. |
| Shipping Method | tray |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V161610BCT-6 | 50,000 | 01+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| W9816G6EH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W9816G6GH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W9816G6IH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W9816G6XH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |