Package | TSOP2 |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 1M |
Bit Organization | x16 |
Density | 16M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 2 banks |
Die Generation | 3rd Gen. |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY57V161610BCT-6 | 50,000 | 01+ | Get Quote |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V161610ET6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610ETP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610ETP-6 FTP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610FTP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610FTP-7/6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610HGT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161610T-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161614BTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161616DTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V161620ETP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |