Package | TSOP2 |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 1M |
Bit Organization | x16 |
Density | 16M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 2 banks |
Die Generation | 5th Gen. |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V161620HGT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W981616AH6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W981616BH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W981616CH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W981616DH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9816AH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9816G6CH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9816G6CH06 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9816G6CH76 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9816G6DH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |