Package | TSOP2 |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 4M |
Bit Organization | x32 |
Density | 128M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 6th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V283220CT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V283220CTP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V283220DTP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V283220LT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V28322OT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V28322QT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V28322T-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9812G2DH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
W9812G2GH6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |