Package | TSOP2 |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 4M |
Bit Organization | x32 |
Density | 128M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V283220CT-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220CT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220DT-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220DT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220ET-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220LT-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V283220LTP-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V28322T-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
W9812G2DH-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |