HY57V641632HGT-P
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 100 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 4M |
| Bit Organization | x16 |
| Density | 64M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 5th Gen. |
| No Of Banks | 8 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V641632HGT-P | 10,000 | 04+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V641632HGLT-P | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |