Package | TSOP2(86) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
EM638325-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325BG-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325BG-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325T3-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6 #160 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6C | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6T | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS-6TC | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |