Package | TSOP2(86) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V643220BTC6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220C(L)T-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220C7-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CCT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CLT-61 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CT-46 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CT-6 #160 #16 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220CT-6 X | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |