HY5V22EMP-6
Product Details
| Package | FBGA |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 4M |
| Bit Organization | x32 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 6th Gen. |
| Power Consumption | normal |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| MT48LC4M32B2-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B27G-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2F-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2FC-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2FC-6 ES | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2GT-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2TA-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |