Package | BGA |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 4M |
Bit Organization | x32 |
Density | 128M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 6th Gen. |
Power Consumption | normal |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
W9812G2DB-75 | BGA | 3.3 V | 133 MHZ | 0 C~+70 C |
W9812G2DB-75 PB FREE | BGA | 3.3 V | 133 MHZ | 0 C~+70 C |