Package | FBGA |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | extended(-25°C~85°C) |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 4M |
Bit Organization | x32 |
Density | 128M |
Package Material | normal |
Hynix Memory | HY |
Die Generation | 1st Gen. |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY5V22GF-HE1 | 500 | 2003+ | Get Quote |