| Package | FBGA |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | extended(-25°C~85°C) |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 4M |
| Bit Organization | x32 |
| Density | 128M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY5V22GF-HE1 | 500 | 2003+ | Get Quote |