HY5V66EFP-7
Product Details
| Package | FBGA-60 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 143 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 4M |
| Bit Organization | x16 |
| Density | 64M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 6th Gen. |
| Power Consumption | normal |
| Shipping Method | tray |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| HY5V66EFP-7 | 3,000 | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| AS4C4M16SA-7B2CN | FBGA-60 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C4M16SA-7B2CNTR | FBGA-60 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY5V66FF6P-7-C | FBGA-60 | 3.3 V | 143 MHZ | 0 C~+70 C |